This course is a hands-on treatment of all aspects of advanced pattern transfer and pattern transfer equipment including probe techniques; stamping and embossing; e-beam; and optical contact and stepper systems. The course is divided into five major sections. The first section is an overview of all pattern generation processes covering aspects from substrate preparation to tool operation. The second section concentrates on photolithography and examines such topics as mask template, and mold generation. Chemical makeup of resists will be discussed including polymers, solvents, sensitizers, and additives. The role or dyes and antireflective coatings will be discussed. In addition, critical dimension (CD) control and profile control of resists will be investigated. The third section will discuss the particle beam lithographic techniques such as e-beam lithography. The fourth section covers probe pattern generation and the fifth section explores imprinting lithography, step-and-flash, stamp lithography, and self-assembled lithography. This course is designed to be one of six capstone courses (Esc 2ll, 212,213,214, 215, 216) for the Penn State Semiconductor Manufacturing Technology (SMT) program. The course is lab intensive, leveraging the Nanofabrication Facility on the University Park campus. All lectures will be given in a technology classroom, Suite 114 Lubert bldg., Manufacturing Technology and thus has a wide variety of very specialized, "hands-on" materials and facilities continually available to students. The course grade evaluation will use a mixture of tests, presentations, reports, and project assignments. Teaming and tem problem solving will be stressed.
Last Updated: 03/01/2016